View MBRP20060CT_1107432.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

MBRP20060CT
Preferred Device
POWERTAPt II SWITCHMODEt Power Rectifier
These state-of-the-art devices use the Schottky Barrier principle with a platinum barrier metal.
Features http://onsemi.com
* Dual Diode Construction - May Be Paralleled for Higher Current * * * * * * * * *
Output Guardring for Stress Protection Low Forward Voltage 150C Operating Junction Temperature Pb-Free Package is Available*
SCHOTTKY BARRIER RECTIFIER 200 AMPERES, 60 VOLTS
1 3 2
Mechanical Characteristics:
Case: Epoxy, Molded with metal heatsink base Weight: 80 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant Top Terminal Torque: 25-40 lb-in max Base Plate Torques: See procedure given in the Package Outline Section
2 1 POWERTAP II CASE 357C PLASTIC
MAXIMUM RATINGS
Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR, TC = 140C) Per Leg Per Device Peak Repetitive Forward Current, (Rated VR, Square Wave, 20 kHz, TC = 140C) Per Leg Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) Peak Repetitive Reverse Current (2.0 ms, 1.0 kHz) Per Leg Storage Temperature Range Operating Junction Temperature Voltage Rate of Change (Rated VR) Symbol VRRM VRWM VR IF(AV) Value 60 Unit V 3
A 100 200 A 200
MARKING DIAGRAM
IFRM
MCC AYYWWG
B20060T
IFSM
1500
A B20060T MCC A YY WW G = Specific Device Code = Mold Compound Code = Assembly Location = Year = Work Week = Pb-Free Package
IRRM Tstg TJ dv/dt
A 2.0 -55 to +150 -55 to +150 10,000 C C V/ms
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
ORDERING INFORMATION
Device MBRP20060CT MBRP20060CTG Package POWERTAP II POWERTAP II (Pb-Free) Shipping 25 Units/Tray 25 Units/Tray
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
Preferred devices are recommended choices for future use and best overall value.
(c) Semiconductor Components Industries, LLC, 2006
September, 2006 - Rev. 4
1
Publication Order Number: MBRP20060CT/D
MBRP20060CT
THERMAL CHARACTERISTICS (Per Leg)
Rating Thermal Resistance, Junction-to-Case Symbol RqJC Value 0.6 Unit C/W
ELECTRICAL CHARACTERISTICS (Per Leg)
Instantaneous Forward Voltage (Note 1) (iF = 200 Amps, TJ = 25C) (iF = 200 Amps, TJ = 100C) Instantaneous Reverse Current (Note 1) (Rated dc Voltage, TJ = 125C) (Rated dc Voltage, TJ = 25C) 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. vF V 0.91 0.80 mA 50 0.5
iR
I F , INSTANTANEOUS FORWARD CURRENT (AMPS)
1000
I F , INSTANTANEOUS FORWARD CURRENT (AMPS)
1000
100 TJ = 150C 10
100
TJ = 150C 10 25C 100C 1.0 0.2 0.3 0.4 0.9 1.0 0.5 0.6 0.7 0.8 VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
25C 100C
1.0
0.2
0.8 0.3 0.4 0.5 0.6 0.7 VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
0.9
Figure 1. Typical Forward Voltage
Figure 2. Maximum Forward Voltage
http://onsemi.com
2
MBRP20060CT
I R , MAXIMUM REVERSE CURRENT (AMPS) 1.0 I R , REVERSE CURRENT (AMPS) 0.1 0.01 100C 0.001 TJ = 150C 1.0 0.1 100C 0.01
0.001 0.0001
0.0001 25C
0.00001 0.000001
25C
0
10
20 30 40 VR, REVERSE VOLTAGE (VOLTS)
50
60
0.00001
0
10
20 30 40 VR, REVERSE VOLTAGE (VOLTS)
50
60
Figure 3. Typical Reverse Current
P FO , AVERAGE POWER DISSIPATION (WATTS)
Figure 4. Maximum Reverse Current
I O , AVERAGE FORWARD CURRENT (AMPS)
160 dc SQUARE WAVE Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10 Ipk/Io = 20
FREQ = 20 kHz
120 100 80 60 40 20 Ipk/Io = 20 SQUARE WAVE Ipk/Io = p Ipk/Io = 5 Ipk/Io = 10
dc
140 120 100 80 60 40 20 0 0 20 40
TJ = 150C 0 0 25 50 75 100 125 150 IO, AVERAGE FORWARD CURRENT (AMPS) 175
60 80 100 120 TC, CASE TEMPERATURE (C)
140
160
Figure 5. Current Derating (PER LEG)
Figure 6. Forward Power Dissipation (PER LEG)
http://onsemi.com
3
MBRP20060CT
10,000 TJ = 25C C, CAPACITANCE (pF)
1,000
100 1.0
10 VR, REVERSE VOLTAGE (VOLTS)
100
Figure 7. Capacitance
R(T) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)
1.0
0.1
0.01
Rtjc(t) = Rtjc*r(t)
0.001 0.00001
0.0001
0.001
0.01 T, TIME (s)
0.1
1.0
10
100
Figure 8. Thermal Response
VCC 12 Vdc
+ 150 V, 10 mAdc 2 kW
12 V 100 2 ms 1 kHz CURRENT AMPLITUDE ADJUST 0-10 AMPS
2N2222 100 W CARBON 2N6277
D.U.T. +
4 mF
1 CARBON 1N5817
Figure 9. Test Circuit for Repetitive Reverse Current
http://onsemi.com
4
MBRP20060CT
MAXIMUM MECHANICAL RATINGS
Terminal Penetration: Terminal Torque: Mounting Torque -- Outside Holes: Mounting Torque -- Center Hole: Seating Plane Flatness 0.235 max 25-40 in-lb max 30-40 in-lb max 8-10 in-lb max 1 mil per in. (between mounting holes)
POWERTAP MECHANICAL DATA APPLIES OVER OPERATING TEMPERATURE
2
Vertical Pull 250 lbs. max
2 in. Lever Pull 50 lbs. max
Note: While the POWERTAP is capable of sustaining these vertical and levered tensions, the intimate contact Note: between POWERTAP and heat sink may be lost. This could lead to thermal runaway. The use of very Note: flexible leads is recommended for the anode connections. Use of thermal grease is highly recommended.
MOUNTING PROCEDURE The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper heat sink. It is important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal contact between the POWERTAP and heat sink. STEP 1: Locate the POWERTAP on the heat sink and start mounting bolts into the threads by hand (2 or 3 turns).
2 -3 TURNS 2 -3 TURNS 2 -3 TURNS
POWER
TAP
HEAT
2 -3 TURNS FINGER-TIGHT
SINK
2 -3 TURNS
STEP 2: Finger tighten the center bolt. The bolt may catch on the threads of the heat sink so it is important to make sure the face of the bolt or washer is in contact with the surface of the POWERTAP. STEP 3: Tighten each of the end bolts between 5 to 10 in-lb.
POWER
TAP
HEAT
5 -10 IN-LB FINGER-TIGHT
SINK
5 -10 IN-LB
POWER
TAP
HEAT
8 -10 IN-LB
SINK
STEP 4: Tighten the center bolt between 8 to 10 in-lb.
5 -10 IN-LB
5 -10 IN-LB
POWER
TAP
HEAT
8 -10 IN-LB
SINK
STEP 5: Finally, tighten the end bolts between 30 to 40 in-lb.
30 -40 IN-LB
30 -40 IN-LB
POWER
TAP
HEAT
SINK
http://onsemi.com
5
MBRP20060CT
PACKAGE DIMENSIONS
CASE 357C-03 POWERTAP PLASTIC PACKAGE ISSUE E
-A- R G -B-
W 0.25 (0.010) N
M
TA
M
B
M
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. TERMINAL PENETRATION: 5.97 (0.235) MAXIMUM. DIM A B C E F G H N Q R U V W INCHES MIN MAX 3.450 3.635 0.700 0.810 0.615 0.640 0.120 0.130 0.435 0.445 1.370 1.380 0.007 0.030 1/4-20UNC-2B 0.270 0.285 31.50 BSC 0.600 0.630 0.330 0.375 0.170 0.190 MILLIMETERS MIN MAX 87.63 92.33 17.78 20.57 15.63 16.26 3.05 3.30 11.05 11.30 34.80 35.05 0.18 0.76 1/4-20UNC-2B 6.86 7.23 80.01 BSC 15.24 16.00 8.39 9.52 4.32 4.82
Q H F
2 PL
0.25 (0.010)
M
TA
M
B
M
C U V
E
-T-
SEATING PLANE
POWERTAP and SWITCHMODE are trademarks of Semiconductor Components Industries, LLC
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
6
MBRP20060CT/D

▲Up To Search▲

Price & Availability of MBRP20060CT

	To Download MBRP20060CT Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .